CMP, uas yog, Chemical Mechanical Polishing, chemical mechanical polishing.
CMPPAD, uas yog, Chemical Mechanical Polishing Pad, chemical mechanical polishing pad.
1. Cov hauv paus ntsiab lus ntawm CMP
Macroscopically hais lus, lub hauv paus ntsiab lus ntawm CMP yog: lub rotating polished wafer yog nias rau ntawm elastic polishing ncoo ntawm CMP ncoo uas rotates nyob rau hauv tib txoj kev, thiab polishing slurry ntws tsis tu ncua ntawm lub wafer thiab lub hauv paus phaj.Lub sab sauv thiab sab discs khiav lag luam nyob rau hauv thim rov qab ntawm kev kub ceev, thiab cov tshuaj tiv thaiv cov khoom nyob rau hauv lub nto ntawm lub polished thiab polished wa ntxiv, thiab cov tshuaj tiv thaiv cov khoom yog ntxiv rau polished wafer. Cov khoom siv tshuaj tiv thaiv raug muab tshem tawm nrog cov polishing slurry.Lub dav hlau tshiab wafer tau dhau los ua cov tshuaj tiv thaiv tshuaj ntxiv, thiab cov khoom raug tshem tawm thiab rov qab mus, tsim ib qho ultra- zoo nto nyob rau hauv kev sib xyaw ua ke ntawm substrate, abrasive hais thiab tshuaj tiv thaiv cov tshuaj tiv thaiv.
2. Kev siv CMP
Lub tswv yim ntawm CMP thev naus laus zis yog thawj zaug los ntawm Monsanto hauv xyoo 1965.Cov thev naus laus zis no yog thawj zaug siv kom tau txais cov iav zoo - zoo li iav tsom iav, xyoo 1988, IBM tau pib siv CMP thev naus laus zis rau kev tsim 4M DRAM, thiab txij li thaum IBM tau ua tiav CMP rau kev tsim cov 64M DRAM 19 lub ntiaj teb sai sai. Txhua yam los yog cov tshuaj polishing nkaus xwb, CMP siv kev sib xyaw ntawm cov tshuaj thiab cov khoom siv los ua kom tsis txhob muaj kev puas tsuaj los ntawm cov khoom siv yooj yim polishing thiab tsis zoo xws li qeeb polishing ceev, tsis zoo nto flatness thiab polishing sib xws uas yooj yim los ntawm cov tshuaj yooj yim polishing. slurry, polished workpiece txav txheeb ze rau polishing ncoo. Los ntawm txoj kev sib xyaw ua ke ntawm cov organic sib tsoo ntawm cov nano{12}} cov khoom thiab cov nyhuv corrosive ntawm cov oxidant, ib tug du nto yog tsim nyob rau saum npoo ntawm polished workpiece.Qhov feem ntau siv ntawm CMP technology yog polishing ntawm silicon wafers ntawm matrix cov ntaub ntawv nyob rau hauv integrated circuits (IC) thiab ultra - scale (ULS 14}). feem ntau ntseeg thoob ntiaj teb tias thaum tus yam ntxwv loj ntawm lub cuab yeej qis dua 0.35µm, lub ntiaj teb kev npaj yuav tsum tau ua kom ntseeg tau tias qhov tseeb thiab kev daws teeb meem ntawm lithographic duab xa mus, thiab CMP tam sim no yuav luag tib lub thev naus laus zis uas tuaj yeem muab cov phiaj xwm thoob ntiaj teb, thiab nws daim ntawv thov ntau tau nthuav dav txhua hnub.
Tam sim no, CMP thev naus laus zis tau tsim los rau hauv CMP thev naus laus zis nrog cov cuab yeej siv tshuaj lom neeg polishing tshuab ua lub cev tseem ceeb, kev sib koom ua ke hauv online nrhiav pom, kawg -point detection, tu thiab lwm yam thev naus laus zis. Nws yog cov khoom lag luam ntawm kev txhim kho kev sib txuas rau micro-kev ua kom zoo, ntau txheej txheej, thinning, thiab flattening txheej txheem.Tam sim no, nws tseem yog cov txheej txheem tsim nyog rau kev hloov pauv ntawm wafers los ntawm 200mm mus rau 300mm thiab txawm loj diameters, kom cov khoom tsim tau, txo cov nqi tsim khoom, thiab flatten lub substrate thoob ntiaj teb.
3. CMP cov cuab yeej siv thiab cov khoom siv
CMP, uas yog, Chemical Mechanical Polishing, chemical mechanical polishing.Cov cuab yeej siv thiab cov khoom siv siv hauv CMP thev naus laus zis suav nrog: tshuab polishing, polishing slurry, CMP ncoo polishing ncoo, post-CMP cov khoom siv tu, polishing kawg taw tes tshawb pom thiab cov txheej txheem tswj cov cuab yeej, cov khoom siv pov tseg thiab kuaj cov khoom, thiab lwm yam.Polishing tshuab thiab polishing pad peb tseem ceeb ntawm CMP polishing pad. Cov txheej txheem, thiab lawv cov kev ua tau zoo thiab kev sib koom ua ke txiav txim siab theem ntawm qhov chaw tiaj tus uas CMP tuaj yeem ua tiav. Ntawm lawv, polishing slurry thiab CMPPAD polishing ncoo yog cov khoom siv.
Plaub, cov teeb meem tseem ceeb hauv cov txheej txheem CMP
Lub hom phiaj tseem ceeb ntawm polishing slurry kev tshawb fawb yog nrhiav kom tau qhov zoo tshaj plaws ua ke ntawm cov tshuaj thiab txhua yam los, kom ib tug polishing slurry nrog siab tshem tawm tus nqi, zoo flatness, zoo zaj duab xis thickness uniformity thiab siab selectivity yuav tsum tau.
Txo qhov tsis xws luag yog lub ntsiab lus nyob mus ib txhis hauv cov txheej txheem CMP thiab txawm tias tag nrho cov chip manufacturing.Lub semiconductor kev lag luam kuj muaj cov "tsis hais cov cai" rau cov txheej txheem CMP, uas yog, cov ntaub ntawv poob ntawm cov cuab yeej tom qab cov txheej txheem CMP yuav tsum tsawg dua 10% ntawm cov thickness ntawm tag nrho cov cuab yeej. effect.Raws li tus yam ntxwv loj ntawm cov cuab yeej txuas ntxiv mus, qhov cuam tshuam ntawm qhov tsis xws luag ntawm cov txheej txheem tswj thiab qhov kawg tawm los ua ntau dua thiab pom tseeb. Qhov luaj li cas ntawm kev tuag yuav tsum muaj tsawg kawg yog 50% ntawm cov cuab yeej loj.
V. Kev vam meej ntawm CMP
Qhov thib peb - tiam dav bandgap semiconductor cov khoom sawv cev los ntawm gallium nitride (GaN) tau tsim kho sai hauv xyoo tas los no. Gallium nitride (GaN)-raws li cov khoom siv semiconductor muaj cov yam ntxwv ntawm kev ua haujlwm siab luminous, zoo thermal conductivity, kub tsis kam, hluav taws xob tsis kam, siab zog thiab siab hardness, thiab tuaj yeem ua rau siab -kev ua haujlwm xiav thiab ntsuab-emitting diodes thiab laser diodes (tseem hu ua lasers). Loj hlob ntawm cov khoom siv substrate zoo ib yam li lawv cov qauv.Tam sim no, cov khoom siv substrate tau lees paub thoob ntiaj teb yog sapphire siv lead ua. Nrog kev loj hlob ntawm kev lag luam thov rau cov khoom siv gallium nitride (GaN), qhov kev thov rau sapphire tseem yuav loj hlob sai.